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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

dc.contributor.authorvan den Ende, Daan
dc.contributor.authorVerhoeven, Frits
dc.contributor.authorvan der Eijnden, Pepijn
dc.contributor.authorKusters, Roel
dc.contributor.authorSridhar, Ashok
dc.contributor.authorCauwe, Maarten
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-21T13:14:41Z
dc.date.available2021-10-21T13:14:41Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23230
dc.sourceIIOimport
dc.titleHigh curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceEuropean Microelectronics Packaging Conference
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - open access


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