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Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan Kerckhove, Matthias
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorD'Haese, Wim
dc.contributor.authorSchaubroeck, David
dc.contributor.authorAllaert, Bart
dc.contributor.authorGeerinckx, Eddy
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-21T13:44:45Z
dc.date.available2021-10-21T13:44:45Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23293
dc.sourceIIOimport
dc.titleImpact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorSchaubroeck, David
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.source.peerreviewyes
dc.source.conferenceEuropean Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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