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15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU

dc.contributor.authorXu, Kaidong
dc.contributor.authorSouriau, Laurent
dc.contributor.authorHellin, David
dc.contributor.authorVersluijs, Janko
dc.contributor.authorWong, Patrick
dc.contributor.authorVangoidsenhoven, Diziana
dc.contributor.authorVandenbroeck, Nadia
dc.contributor.authorDekkers, Harold
dc.contributor.authorShi, Xiaoping
dc.contributor.authorAlbert, Johan
dc.contributor.authorTan, Chi Lim
dc.contributor.authorVertommen, Johan
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorOrain, I.
dc.contributor.authorKimura, Y.
dc.contributor.authorWiaux, Vincent
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-21T14:45:20Z
dc.date.available2021-10-21T14:45:20Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23409
dc.sourceIIOimport
dc.title15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU
dc.typeProceedings paper
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.imecauthorHellin, David
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorWong, Patrick
dc.contributor.imecauthorVangoidsenhoven, Diziana
dc.contributor.imecauthorVandenbroeck, Nadia
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorWiaux, Vincent
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.contributor.orcidimecWong, Patrick::0000-0003-3605-9680
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage86850C
dc.source.conferenceAdvanced Etch Technology for Nanopatterning II
dc.source.conferencedate23/02/2013
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=1674531
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 8685


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