Show simple item record

Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials

dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDaily, Robert
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T00:51:08Z
dc.date.available2021-10-22T00:51:08Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23597
dc.sourceIIOimport
dc.titleReliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
dc.typeProceedings paper
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage444
dc.source.endpage448
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028355
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
29942.pdf
Size:
906.2Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record