Performance and perspectives of 0-level MEMS chip packages with vertical interconnects

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Authors

Cherman, Vladimir; Pham, Nga; Slabbekoorn, John; Faes, Alessandro; Margesin, Benno; Tilmans, Harrie

ISSN

1551-4897

Issue

3

Journal

Journal of Microelectronics and Electronic Packaging

Volume

11

Title

Performance and perspectives of 0-level MEMS chip packages with vertical interconnects

Publication type

Journal article

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