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3D stacking induced mechanical stress effects

dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorLofrano, Melina
dc.contributor.authorSimons, Veerle
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorGuo, Wei
dc.contributor.authorBeyer, Gerald
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T00:56:44Z
dc.date.available2021-10-22T00:56:44Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23641
dc.sourceIIOimport
dc.title3D stacking induced mechanical stress effects
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage309
dc.source.endpage315
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897304&contentType=Conference+Publications
imec.availabilityPublished - imec


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