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Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDetalle, Mikael
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorDaily, Robert
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T01:11:09Z
dc.date.available2021-10-22T01:11:09Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23734
dc.sourceIIOimport
dc.titleComparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conferenceIEEE 3D Sytem Integration Conference - 3DIC
dc.source.conferencedate1/12/2014
dc.source.conferencelocationKinsale Ierland
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7152146/?arnumber=7152146
imec.availabilityPublished - open access


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