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Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
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Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
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Date
2014-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Wolf, Ingrid
;
Simons, Veerle
;
Lofrano, Melina
;
Cherman, Vladimir
;
De Vos, Joeri
;
Van der Plas, Geert
;
Beyne, Eric
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1836
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Acq. date: 2025-12-18
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Metrics
Views
1836
since deposited on 2021-10-22
2
last month
1
last week
Acq. date: 2025-12-18
Citations