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Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSimons, Veerle
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T01:11:30Z
dc.date.available2021-10-22T01:11:30Z
dc.date.issued2014-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23736
dc.sourceIIOimport
dc.titleRaman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage978
dc.source.endpage983
dc.source.conferenceElectronics System-Integration Technology Conference - ESTC
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finland
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962729
imec.availabilityPublished - imec


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