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Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly

dc.contributor.authorDubey, Vikas
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T01:19:52Z
dc.date.available2021-10-22T01:19:52Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23777
dc.sourceIIOimport
dc.titleRoom temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly
dc.typeProceedings paper
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage579
dc.source.endpage582
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028296
imec.availabilityPublished - open access


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