Authors

Dussart, R.; Tillocher, T.; Gosset, N; Lefaucheux, P.; L'jazouli, R; Boufnichel, M.; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Nishimura, E; Yatsuda, K; Maekawa, K

Conference

ECS Fall Meeting Symposium P5: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

Title

Cryoetching of silicon and advanced materials for 3D interconnects

Publication type

Meeting abstract