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Impact of stressors in future SiGe-based FinFETs: mobility boost and scalability

dc.contributor.authorEneman, Geert
dc.contributor.authorBrunco, David
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorMitard, Jerome
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorRoussel, Philippe
dc.contributor.authorLoo, Roger
dc.contributor.authorVeloso, Anabela
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.date.accessioned2021-10-22T01:23:14Z
dc.date.available2021-10-22T01:23:14Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23793
dc.sourceIIOimport
dc.titleImpact of stressors in future SiGe-based FinFETs: mobility boost and scalability
dc.typeProceedings paper
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorMitard, Jerome
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecMitard, Jerome::0000-0002-7422-079X
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage9
dc.source.endpage10
dc.source.conference7th International Silicon-Germanium Technology and Device Meeting - ISTDM
dc.source.conferencedate2/06/2014
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6874646
imec.availabilityPublished - open access


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