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Mechanical stability of Cu/low-k BEOL interconnects

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCroes, Kristof
dc.contributor.authorKljucar, Luka
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-22T01:40:48Z
dc.date.available2021-10-22T01:40:48Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23867
dc.sourceIIOimport
dc.titleMechanical stability of Cu/low-k BEOL interconnects
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2F.2.1
dc.source.endpage2F.2.6
dc.source.conferenceInternational Reliability Physics Symposium - IRPS
dc.source.conferencedate3/06/2014
dc.source.conferencelocationWaikoloa, HI USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6860606&contentType=Conference+Publications
imec.availabilityPublished - open access


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