dc.contributor.author | Hu, Yu-Hsiang | |
dc.contributor.author | Liu, C.S. | |
dc.contributor.author | Chen, M.T. | |
dc.contributor.author | Cheng, M.D. | |
dc.contributor.author | Kuo, H.J. | |
dc.contributor.author | Lii, M.J. | |
dc.contributor.author | La Manna, Antonio | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | Wang, Teng | |
dc.contributor.author | Daily, Robert | |
dc.contributor.author | Capuz, Giovanni | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Yu, Doug C.H. | |
dc.date.accessioned | 2021-10-22T02:07:59Z | |
dc.date.available | 2021-10-22T02:07:59Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23966 | |
dc.source | IIOimport | |
dc.title | Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | La Manna, Antonio | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 572 | |
dc.source.endpage | 575 | |
dc.source.conference | IEEE 64th Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 27/05/2014 | |
dc.source.conferencelocation | Lake Buena Vista, FL USA | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897342&contentType=Conference+Publications | |
imec.availability | Published - open access | |