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Electroless Cu seed on Ru and Co liners in high aspect ratio TSV

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTanaka, Tetsu
dc.date.accessioned2021-10-22T02:14:06Z
dc.date.available2021-10-22T02:14:06Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23986
dc.sourceIIOimport
dc.titleElectroless Cu seed on Ru and Co liners in high aspect ratio TSV
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewno
dc.source.beginpage207
dc.source.endpage210
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6831871
imec.availabilityPublished - imec


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