Authors

Ivankovic, Andrej; Cherman, Vladimir; Gonzalez, Mario; Vandevelde, Bart; Vandepitte, Dirk; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid

Conference

15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE

Title

The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses

Publication type

Proceedings paper

Embargo date

9999-12-31