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The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses

dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-22T02:15:58Z
dc.date.available2021-10-22T02:15:58Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23992
dc.sourceIIOimport
dc.titleThe underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage8
dc.source.conference15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate6/04/2013
dc.source.conferencelocationGent Belgium
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813831&contentType=Conference+Publications
imec.availabilityPublished - open access


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