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Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes

dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBailey, Susan
dc.contributor.authorPrivett, Mark
dc.contributor.authorArnold, Kim
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T02:23:44Z
dc.date.available2021-10-22T02:23:44Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24017
dc.sourceIIOimport
dc.titleThick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage894
dc.source.endpage898
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897393&queryText%3DThick+adhesive+temporary+bonding+for+high+top
imec.availabilityPublished - open access


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