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Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications

dc.contributor.authorKusters, Roel
dc.contributor.authorSridhar, Ashok
dc.contributor.authorCauwe, Maarten
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-22T02:45:46Z
dc.date.available2021-10-22T02:45:46Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24083
dc.sourceIIOimport
dc.titleFlip-chip bonding of fine-pitch ultra-thin chips for SiF applications
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conferenceElectronics System-Integration Technology Conference
dc.source.conferencedate16/09/2014
dc.source.conferencelocationHelsinki Finland
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6962786
imec.availabilityPublished - open access


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