dc.contributor.author | Marinissen, Erik Jan | |
dc.contributor.author | De Wachter, Bart | |
dc.contributor.author | O'Loughlin, Stephen | |
dc.contributor.author | Deutsch, Sergej | |
dc.contributor.author | Papameletis, Christos | |
dc.contributor.author | Burgherr, Tobias | |
dc.date.accessioned | 2021-10-22T03:30:19Z | |
dc.date.available | 2021-10-22T03:30:19Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24205 | |
dc.source | IIOimport | |
dc.title | Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.imecauthor | De Wachter, Bart | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | no | |
dc.source.conference | Design, Automation, and Test in Europe - DATE': Friday Workshop on 3D Integration | |
dc.source.conferencedate | 28/03/2014 | |
dc.source.conferencelocation | Dresden Germany | |
imec.availability | Published - imec | |