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Thermal aspects of 3D and 2.5D integration

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T04:29:25Z
dc.date.available2021-10-22T04:29:25Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24350
dc.sourceIIOimport
dc.titleThermal aspects of 3D and 2.5D integration
dc.typeOral presentation
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS-Benelux Winter Event 2014: Heat Management in Microelectronic systems
dc.source.conferencedate23/01/2014
dc.source.conferencelocationGent Belgium
imec.availabilityPublished - imec


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