Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

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Authors
Pham, Nga; Soussan, Philippe; Peng, Lan; Rosmeulen, Maarten; Sabuncuoglu Tezcan, Deniz
Conference
16th IEEE Electronics Packaging Technology Conference
Title
Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process
Publication type
Proceedings paper
Embargo date
9999-12-31
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