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Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDjuric, Tatjana
dc.contributor.authorHoffrogge, Peter
dc.contributor.authorBrand, Sebastien
dc.contributor.authorCzurratis, Peter
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorBeyer, Gerald
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T04:45:18Z
dc.date.available2021-10-22T04:45:18Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24386
dc.sourceIIOimport
dc.titleDefect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage850
dc.source.endpage855
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://dx.doi.org/10.1109/ECTC.2014.6897385
imec.availabilityPublished - imec


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