dc.contributor.author | Podpod, Arnita | |
dc.contributor.author | Demeurisse, Caroline | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Capuz, Giovanni | |
dc.contributor.author | Duval, Fabrice | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-22T04:48:18Z | |
dc.date.available | 2021-10-22T04:48:18Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24393 | |
dc.source | IIOimport | |
dc.title | Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Podpod, Arnita | |
dc.contributor.imecauthor | Demeurisse, Caroline | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.imecauthor | Duval, Fabrice | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 75 | |
dc.source.endpage | 79 | |
dc.source.conference | 16th IEEE Electronic Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 3/12/2014 | |
dc.source.conferencelocation | Singapore Singapore | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028283 | |
imec.availability | Published - open access | |