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Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

dc.contributor.authorPotoms, Goedele
dc.contributor.authorWang, Teng
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T04:50:17Z
dc.date.available2021-10-22T04:50:17Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24397
dc.sourceIIOimport
dc.titleCu-Cu insertion bonding technique using photosensitive polymer as WLUF
dc.typeProceedings paper
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage313
dc.source.endpage317
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationMarina Bay Sands Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028331
imec.availabilityPublished - imec


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