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Cu wire resistance improvement using Mn-based self-formed barriers

dc.contributor.authorSiew, Yong Kong
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorCiofi, Ivan
dc.contributor.authorCroes, Kristof
dc.contributor.authorWilson, Chris
dc.contributor.authorTang, Baojun
dc.contributor.authorDemuynck, Steven
dc.contributor.authorAi, Huang
dc.contributor.authorCellier, Daniel
dc.contributor.authorCockburn, Andrew
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-22T05:49:20Z
dc.date.available2021-10-22T05:49:20Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24524
dc.sourceIIOimport
dc.titleCu wire resistance improvement using Mn-based self-formed barriers
dc.typeProceedings paper
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorCellier, Daniel
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage311
dc.source.endpage314
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationGrenoble France
dc.identifier.urlCu wire resistance improvement using Mn-based self-formed barriers
imec.availabilityPublished - imec


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