Publication:

Cu wire resistance improvement using Mn-based self-formed barriers

Date

2014

Proceedings Paper

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Author(s)

Siew, Yong Kong

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Jourdan, Nicolas

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Demuynck, Steven

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Cellier, Daniel

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Cockburn, Andrew

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Boemmels, Juergen

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1991 since deposited on 2021-10-22

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Acq. date: 2026-08-19