Publication:

Cu wire resistance improvement using Mn-based self-formed barriers

Date

2014
Proceedings Paper
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dc.contributor.authorSiew, Yong Kong
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorCiofi, Ivan
dc.contributor.authorCroes, Kristof
dc.contributor.authorWilson, Chris
dc.contributor.authorTang, Baojun
dc.contributor.authorDemuynck, Steven
dc.contributor.authorAi, Huang
dc.contributor.authorCellier, Daniel
dc.contributor.authorCockburn, Andrew
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorCellier, Daniel
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-22T05:49:20Z
dc.date.available2021-10-22T05:49:20Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24524
dc.identifier.urlCu wire resistance improvement using Mn-based self-formed barriers
dc.source.beginpage311
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationGrenoble France
dc.source.endpage314
dc.title

Cu wire resistance improvement using Mn-based self-formed barriers

dc.typeProceedings paper
dspace.entity.typePublication
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