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Cu wire resistance improvement using Mn-based self-formed barriers
Publication:
Cu wire resistance improvement using Mn-based self-formed barriers
Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siew, Yong Kong
;
Jourdan, Nicolas
;
Ciofi, Ivan
;
Croes, Kristof
;
Wilson, Chris
;
Tang, Baojun
;
Demuynck, Steven
;
Ai, Huang
;
Cellier, Daniel
;
Cockburn, Andrew
;
Boemmels, Juergen
;
Tokei, Zsolt
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1978
since deposited on 2021-10-22
Acq. date: 2025-10-28
Citations
Metrics
Views
1978
since deposited on 2021-10-22
Acq. date: 2025-10-28
Citations