Authors

Suhard, Samuel; Moussa, Alain; Slabbekoorn, John; Beirnaert, Filip; De Preter, Inge; Holsteyns, Frank

Conference

Ultra Clean Processing of Semiconductor Surfaces XII - UCPSSXII

Title

Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development

Publication type

Proceedings paper