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Analysis of 3D interconnect performances Versus Si interposer substrate resistivity
Publication:
Analysis of 3D interconnect performances Versus Si interposer substrate resistivity
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Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Van der Plas, Geert
;
Detalle, Mikael
;
Beyne, Eric
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1934
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Views
1934
since deposited on 2021-10-22
1
last month
1
last week
Acq. date: 2026-02-25
Citations