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Analysis of 3D interconnect performances Versus Si interposer substrate resistivity

dc.contributor.authorSun, Xiao
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDetalle, Mikael
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T06:14:52Z
dc.date.available2021-10-22T06:14:52Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24576
dc.sourceIIOimport
dc.titleAnalysis of 3D interconnect performances Versus Si interposer substrate resistivity
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE 3D System Integration Conference - 3DIC
dc.source.conferencedate1/12/2014
dc.source.conferencelocationKinsale Ireland
imec.availabilityPublished - imec


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