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dc.contributor.authorVakanas, George
dc.contributor.authorO, Minho
dc.contributor.authorDimcic, Biljana
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVanstreels, Kris
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGuerrieri, Stefano
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorKajihara, Masanori
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T06:52:53Z
dc.date.available2021-10-22T06:52:53Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24653
dc.sourceIIOimport
dc.titleCo-Sn intermetallic compoundsfor potential integration in 3D interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference23rd Conference on Materials for Advanced Metallization - MAM
dc.source.conferencedate2/03/2014
dc.source.conferencelocationChemnitz Germany
imec.availabilityPublished - imec


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