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Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications

dc.contributor.authorVakanas, George
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorSnyder, Brad
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorCroes, Kristof
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T06:53:54Z
dc.date.available2021-10-22T06:53:54Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24655
dc.sourceIIOimport
dc.titleBismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
dc.typeMeeting abstract
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference23rd Conference on Materials for Advanced Metallization - MAM
dc.source.conferencedate2/03/2013
dc.source.conferencelocationChemnitz Germany
imec.availabilityPublished - imec


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