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Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

dc.contributor.authorVakanas, George
dc.contributor.authorWang, Teng
dc.contributor.authorTatsumi, Koji
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCroes, Kristof
dc.contributor.authorHua, Fay
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T06:55:00Z
dc.date.available2021-10-22T06:55:00Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24657
dc.sourceIIOimport
dc.titleMetallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
dc.typeMeeting abstract
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceTMS Annual Meeting & Exhibition
dc.source.conferencedate16/02/2014
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/43CE740C1845254685257B98004437BA?OpenDocument
imec.availabilityPublished - open access


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