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3D IC interconnects: microbump yield electrical characterization and TSV modeling

dc.contributor.authorVakoula, Panagiota
dc.contributor.authorTyrovouzi, Anna-Maria
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorStucchi, Michele
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-22T06:56:00Z
dc.date.available2021-10-22T06:56:00Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24659
dc.sourceIIOimport
dc.title3D IC interconnects: microbump yield electrical characterization and TSV modeling
dc.typeProceedings paper
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewno
dc.source.conferenceElectrical and Computer Engineering Greek Student Conference
dc.source.conferencedate11/04/2014
dc.source.conferencelocationThessaloniki Greece
imec.availabilityPublished - imec


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