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Mechanical analysis of encapsulated metal interconnects under transversal load

dc.contributor.authorVan Keymeulen, Bjorn
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-22T07:15:49Z
dc.date.available2021-10-22T07:15:49Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24701
dc.sourceIIOimport
dc.titleMechanical analysis of encapsulated metal interconnects under transversal load
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage8
dc.source.conference15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate7/04/2014
dc.source.conferencelocationGent Belgium
dc.identifier.urlhttp://ieeexplore.ieee.org/document/6813842/
imec.availabilityPublished - open access


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