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An alternative 3D packaging route thru wafer reconstruction

dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorGerets, Carine
dc.contributor.authorPotoms, Goedele
dc.contributor.authorVerwoerdt, Rudy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorBrouwer, Erik
dc.date.accessioned2021-10-22T18:36:30Z
dc.date.available2021-10-22T18:36:30Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25030
dc.sourceIIOimport
dc.titleAn alternative 3D packaging route thru wafer reconstruction
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference17th Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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