Authors

Cavaco, Celso; Peng, Lan; Sebaai, Farid; Verbinnen, Greet; Visker, Jakob; Van Olmen, Jan; Sabuncuoglu Tezcan, Deniz; Osman, Haris

Conference

Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

Title

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

Publication type

Proceedings paper