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On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
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On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
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Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cavaco, Celso
;
Peng, Lan
;
Sebaai, Farid
;
Verbinnen, Greet
;
Visker, Jakob
;
Van Olmen, Jan
;
Sabuncuoglu Tezcan, Deniz
;
Osman, Haris
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1956
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-16
Citations
Metrics
Views
1956
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-16
Citations