dc.contributor.author | Cavaco, Celso | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Sebaai, Farid | |
dc.contributor.author | Verbinnen, Greet | |
dc.contributor.author | Visker, Jakob | |
dc.contributor.author | Van Olmen, Jan | |
dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.author | Osman, Haris | |
dc.date.accessioned | 2021-10-22T18:37:14Z | |
dc.date.available | 2021-10-22T18:37:14Z | |
dc.date.issued | 2015 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25037 | |
dc.source | IIOimport | |
dc.title | On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Cavaco, Celso | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Sebaai, Farid | |
dc.contributor.imecauthor | Verbinnen, Greet | |
dc.contributor.imecauthor | Visker, Jakob | |
dc.contributor.imecauthor | Van Olmen, Jan | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.imecauthor | Osman, Haris | |
dc.contributor.orcidimec | Cavaco, Celso::0000-0001-9079-338X | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 123 | |
dc.source.endpage | 129 | |
dc.source.conference | Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 | |
dc.source.conferencedate | 5/10/2014 | |
dc.source.conferencelocation | Cancun Mexico | |
dc.identifier.url | http://ecst.ecsdl.org/content/64/40/123.abstract | |
imec.availability | Published - imec | |
imec.internalnotes | ECS Proceedings; Vol. 64, Issue 40 | |