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On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

dc.contributor.authorCavaco, Celso
dc.contributor.authorPeng, Lan
dc.contributor.authorSebaai, Farid
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorVisker, Jakob
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorOsman, Haris
dc.date.accessioned2021-10-22T18:37:14Z
dc.date.available2021-10-22T18:37:14Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25037
dc.sourceIIOimport
dc.titleOn the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
dc.typeProceedings paper
dc.contributor.imecauthorCavaco, Celso
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorOsman, Haris
dc.contributor.orcidimecCavaco, Celso::0000-0001-9079-338X
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewyes
dc.source.beginpage123
dc.source.endpage129
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
dc.source.conferencedate5/10/2014
dc.source.conferencelocationCancun Mexico
dc.identifier.urlhttp://ecst.ecsdl.org/content/64/40/123.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Proceedings; Vol. 64, Issue 40


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