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Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies

dc.contributor.authorCroes, Kristof
dc.contributor.authorWu, Chen
dc.contributor.authorKocaay, Deniz
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-22T18:46:45Z
dc.date.available2021-10-22T18:46:45Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25114
dc.sourceIIOimport
dc.titleReliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage295
dc.source.endpage298
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325585
imec.availabilityPublished - open access


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