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3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorWang, Teng
dc.contributor.authorBex, Pieter
dc.contributor.authorStruyf, Herbert
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorAttard, A.
dc.contributor.authorEberharter, W.
dc.contributor.authorKlingler, H.
dc.date.accessioned2021-10-22T18:47:29Z
dc.date.available2021-10-22T18:47:29Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25119
dc.sourceIIOimport
dc.title3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
dc.typeMeeting abstract
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage56
dc.source.endpage60
dc.source.conferenceInternational Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC
dc.source.conferencedate14/04/2015
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7111000
imec.availabilityPublished - open access


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