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Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
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Authors
De Vos, Joeri
;
Stucchi, Michele
;
Jourdain, Anne
;
Beyne, Eric
;
Patel, Jash
;
Crook, Kath
;
Carruthers, Mark
;
Hopkins, Janet
;
Ashraf, Huma
Conference
17th Electronics Packaging Technology Conference - EPTC
Title
Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
Publication type
Proceedings paper
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