Publication:
Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
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1904 since deposited on 2021-10-22
1last month
Acq. date: 2026-03-17
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Views
1904 since deposited on 2021-10-22
1last month
Acq. date: 2026-03-17
Citations