Publication:
Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
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1905 since deposited on 2021-10-22
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Acq. date: 2026-08-05
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Views
1905 since deposited on 2021-10-22
1last month
1last week
Acq. date: 2026-08-05
Citations