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Ni/Cu plated n-Si rear junction cells with efficiencies up to 22%?(and above)

dc.contributor.authorDuerinckx, Filip
dc.contributor.authorUruena De Castro, Angel
dc.contributor.authorAleman, Monica
dc.contributor.authorCornagliotti, Emanuele
dc.contributor.authorSharma, Aashish
dc.contributor.authorChoulat, Patrick
dc.contributor.authorTous, Loic
dc.contributor.authorRecaman Payo, Maria
dc.contributor.authorKuzma Filipek, Izabela
dc.contributor.authorHajjiah, Ali
dc.contributor.authorDang Thi Thuy, Chi
dc.contributor.authorRussell, Richard
dc.contributor.authorHaslinger, Michael
dc.contributor.authorJohn, Joachim
dc.contributor.authorSzlufcik, Jozef
dc.date.accessioned2021-10-22T19:07:16Z
dc.date.available2021-10-22T19:07:16Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25233
dc.sourceIIOimport
dc.titleNi/Cu plated n-Si rear junction cells with efficiencies up to 22%?(and above)
dc.typeOral presentation
dc.contributor.imecauthorDuerinckx, Filip
dc.contributor.imecauthorAleman, Monica
dc.contributor.imecauthorCornagliotti, Emanuele
dc.contributor.imecauthorChoulat, Patrick
dc.contributor.imecauthorTous, Loic
dc.contributor.imecauthorRecaman Payo, Maria
dc.contributor.imecauthorKuzma Filipek, Izabela
dc.contributor.imecauthorDang Thi Thuy, Chi
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorSzlufcik, Jozef
dc.contributor.orcidimecDuerinckx, Filip::0000-0003-2570-7371
dc.contributor.orcidimecTous, Loic::0000-0001-9928-7774
dc.source.peerreviewno
dc.source.conferencenPV Workshop
dc.source.conferencedate25/03/2015
dc.source.conferencelocationKonstanz Germany
imec.availabilityPublished - imec


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