Authors

Guo, Wei; Karmarkar, Aditya; Xu, Xiaopeng; Van der Plas, Geert; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Absil, Philippe; El Sayed, Karim; Beyne, Eric

Conference

IEEE 65th Electronic Components & Technology Conference - ECTC

Title

Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

Publication type

Proceedings paper

Embargo date

9999-12-31