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Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

dc.contributor.authorGuo, Wei
dc.contributor.authorKarmarkar, Aditya
dc.contributor.authorXu, Xiaopeng
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorGonzalez, Mario
dc.contributor.authorAbsil, Philippe
dc.contributor.authorEl Sayed, Karim
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T19:32:49Z
dc.date.available2021-10-22T19:32:49Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25346
dc.sourceIIOimport
dc.titleAnalysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
dc.typeProceedings paper
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1038
dc.source.endpage1044
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate2/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159723
imec.availabilityPublished - open access


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