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Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

dc.contributor.authorHalder, Sandip
dc.contributor.authorTruffert, Vincent
dc.contributor.authorVan Den Heuvel, Dieter
dc.contributor.authorLeray, Philippe
dc.contributor.authorCheng, Shaunee
dc.contributor.authorMcIntyre, Greg
dc.contributor.authorSah, Kaushik
dc.contributor.authorBrown, Jim
dc.contributor.authorParisi, Paolo
dc.contributor.authorPolli, Marco
dc.date.accessioned2021-10-22T19:35:38Z
dc.date.available2021-10-22T19:35:38Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25357
dc.sourceIIOimport
dc.titleInspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorVan Den Heuvel, Dieter
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorSah, Kaushik
dc.contributor.imecauthorParisi, Paolo
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage19
dc.source.endpage22
dc.source.conference26th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate3/05/2015
dc.source.conferencelocationSaratoga Springs, NY USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7164444
imec.availabilityPublished - open access


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