Show simple item record

Single-release-layer process for temporary bonding applications in 3D integration area

dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBai, Dongshun
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T19:59:04Z
dc.date.available2021-10-22T19:59:04Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25443
dc.sourceIIOimport
dc.titleSingle-release-layer process for temporary bonding applications in 3D integration area
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage896
dc.source.endpage898
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159699
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
30506.pdf
Size:
1.135Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record