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Development of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning

dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorDecoster, Stefan
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-22T20:06:10Z
dc.date.available2021-10-22T20:06:10Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25466
dc.sourceIIOimport
dc.titleDevelopment of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning
dc.typeProceedings paper
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage207
dc.source.endpage214
dc.source.conferenceSemiconductor Cleaning Science and Technology 14 - SCST 14
dc.source.conferencedate11/10/2015
dc.source.conferencelocationPhoenix, AZ USA
dc.identifier.urlhttp://ecst.ecsdl.org/content/69/8/207.abstract?related-urls=yes&legid=ecst;69/8/207
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 69, Issue 8


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