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Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorVanstreels, Kris
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-22T20:13:59Z
dc.date.available2021-10-22T20:13:59Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25491
dc.sourceIIOimport
dc.titlePost-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics
dc.typeProceedings paper
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage103
dc.source.endpage106
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325642
imec.availabilityPublished - open access


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